Hot melt adhesive

It is made by high temperature reaction of dimeric acid and polyamine.Soluble in general organic solvents, its heating melting viscosity and heating temperature has a great relationship. It has the characteristics of low viscosity, good flow performance, good toughness and high bond strength.

Performance Characteristics

1.  It has good low temperature solubility and soluble fusibility
2.  It has high thermal stability.
3.  It has strong flexibility.

Usage

1. Hot melt adhesive for electronic and electrical shrinkable materials.
2. shoe material, clothing, leather and other hot glue.
3. hot melt adhesive, etc

Two-in-one paper-plastic packaging bag, 25KG/ bag.